JPS6311697Y2 - - Google Patents
Info
- Publication number
- JPS6311697Y2 JPS6311697Y2 JP1983035842U JP3584283U JPS6311697Y2 JP S6311697 Y2 JPS6311697 Y2 JP S6311697Y2 JP 1983035842 U JP1983035842 U JP 1983035842U JP 3584283 U JP3584283 U JP 3584283U JP S6311697 Y2 JPS6311697 Y2 JP S6311697Y2
- Authority
- JP
- Japan
- Prior art keywords
- terminal
- electronic component
- lead
- ceramic electronic
- terminal leads
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Thermistors And Varistors (AREA)
- Ceramic Capacitors (AREA)
- Details Of Resistors (AREA)
- Non-Adjustable Resistors (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3584283U JPS59143031U (ja) | 1983-03-11 | 1983-03-11 | セラミツク電子部品 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3584283U JPS59143031U (ja) | 1983-03-11 | 1983-03-11 | セラミツク電子部品 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS59143031U JPS59143031U (ja) | 1984-09-25 |
JPS6311697Y2 true JPS6311697Y2 (en]) | 1988-04-05 |
Family
ID=30166529
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3584283U Granted JPS59143031U (ja) | 1983-03-11 | 1983-03-11 | セラミツク電子部品 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59143031U (en]) |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4913841U (en]) * | 1972-05-12 | 1974-02-05 |
-
1983
- 1983-03-11 JP JP3584283U patent/JPS59143031U/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS59143031U (ja) | 1984-09-25 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US4214120A (en) | Electronic device package having solder leads and methods of assembling the package | |
EP0159771B1 (en) | Chip resistors and forming method | |
JPH0365005B2 (en]) | ||
JPS6311697Y2 (en]) | ||
DE3625238C2 (en]) | ||
US5044071A (en) | Manufacturing method for taping electronic component | |
JPH0411984Y2 (en]) | ||
JPH0227522Y2 (en]) | ||
DE2735989A1 (de) | Elektrisches, mit isoliermasse umhuelltes bauelement und verfahren zur herstellung | |
JPH0564479B2 (en]) | ||
JPH0310714Y2 (en]) | ||
JPH081564Y2 (ja) | セラミック基板回路のリード線構造 | |
JPS62292258A (ja) | 溝付半田鍍金線 | |
JPH0533807B2 (en]) | ||
JPS6350860Y2 (en]) | ||
JPH0737373Y2 (ja) | バラン変換器 | |
JP2530273Y2 (ja) | リードフレーム | |
JPS5918662Y2 (ja) | コンデンサ用端子板 | |
JPH0135449Y2 (en]) | ||
JPS6230309A (ja) | 電子部品の製造方法 | |
JPH0670934B2 (ja) | リード端子フレーム | |
JPS6223478B2 (en]) | ||
JPS6230308A (ja) | 電子部品の製造方法 | |
JP3348596B2 (ja) | 集積回路装置の製造方法 | |
JPS6257246B2 (en]) |